| PART |
Description |
Maker |
| 4-1542003-4 |
Heat Sink Assemblies; HTS572-U=42.5MMHS ASSY ULTEM C ( Tyco Electronics )
|
Tyco Electronics
|
| 4-1542002-7 |
Heat Sink Assemblies; HTS430NF-U=35MMLP HS ASSY A-TE ( Tyco Electronics )
|
Tyco Electronics
|
| 1542004-5 |
Heat Sink Assemblies; HTS705-U=25MM HS ASSY ULTEM CL ( Tyco Electronics )
|
Tyco Electronics
|
| ATS037037025-PF-12X |
37.00 x 37.00 x 25.00 mm BGA Heat Sink (Heat Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| 37717-1001 37717-0001 |
CoolFin Heat Sink with Integrated Heat Pipes
|
Molex Electronics Ltd.
|
| VHS-95 |
Extruded Heat Sink
|
CUI INC,
|
| C60-075-VE C60-075-AE B60-075-AE B60-075-VE |
Heat Sink System
|
Ohmite Mfg. Co.
|
| ATS-19G-115-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE Electronics, Inc.
|
| ATS-312-EXL-R0 |
HEAT SINK THERMAL RESISTANCE
|
Advanced Thermal Solutions, Inc.
|
| CP308 CP3010 CP300 CP306 CP304 CP302 CP301 |
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A, HEAT-SINK MTG 3A 单相硅桥式PC的MTG的甲，热沉MTG3A
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A
|
Transys Electronics, Ltd.
TRSYS
|
| ATS-1103-C1-R0 |
Heat Sink for Half Brick DC-DC Converter
|
Advanced Thermal Soluti...
|
